Contract Manufacturing of Circuit Board Assemblies
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A and M Electronics, Inc. provides contract manufacturing of single-sided and multilayered class III circuit board assemblies using SMT, BGA, micro BGA, and through hole manufacturing methods. Boards can be manufactured from fiberglass or standardized FR-4 epoxy laminate in sizes up to 14″ x 16″. Our automated SMT machine can build assemblies with a repeatability of .025 mm at a rate of 13,500 cph. We are also capable of hand soldering and applying conformal coating to assemblies that will be used in harsh environments. All of our operators are IPC-A-610 certified, most of which have been with us for over 20 years. Our automated optical inspection (AIO) system checks assemblies for conformance, while our in-line de-ionized aqueous cleaning system removes flux from the boards and ensure all assemblies are clean and dry.

Our customers require the highest degree of quality and reliability. To that end, we have achieved and maintained a number of industry specific certifications including IPC/ANSI J-STD-001, AS9100, ITAR registration, RoHs compliance, NADCAP, ISO 9001:2015 and AS9100D certifications. We also meet all applicable Mil-Spec standards. Burn-in testing, engineering and design, first articles, and packaging services are also available. For more information about our contract manufacturing of circuit board assemblies, see the table below, or contact us directly.

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Circuit Board Construction

SMT
BGA

Micro BGA
Through Hole

Materials

Flex Cable
Standardized FR-4

Fiberglass

Assembly Methods

Machine Placed SMT
Hand Soldering

IPA 610 Certified Operators
Conformal Coating

Cleaning System

De-ionized

Flux Removal

Baking (Prevents)

Thermal Damage

Measling

Components

0201 to .075mm

.0029 in

Repeatability (+/-)

.025 mm

.001 in

Placement Speed

13500 cph

Board Length

Up to 16 in

Board Width

Up to 14 in

Inspection

Automatic Optical Inspection (AOI)

Testing

Ionic Contamination

Customer Furnished Equipment

Quality

Class III

Additional Services

Packaging
First Articles

Burn-In
Engineering & Design Services

Turnaround Time

2 weeks

Quick Turn Available

Production Volume

Prototype to Production

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Industry Focus

Military
Medical

Commercial

Industry Standards

Mil-Spec
ANSI / J-STD-001
AS9100D
ISO 9001:2015

ITAR (DDTC)
IPC -A-610
RoHS
NADCAP

File Formats

Gerber
DXF

PDF